It has a wide range of temperatures and sufficient adsorption
Custom-made/heater design
No change over time due to deterioration of the electrode
Application: Semiconductor/PVD/etc
Size : 4'' ~ 12''
2. Pin - chuck
Characteristics
High precision polishing
Local flatness control
Wafer flatness control
Application : Semiconductor / Photo / etc
Size : 4'' ~ 12''
3. AI2O3 THERMAL SPRAYED ESC
Characteristics
The insulating layer is precisely formed
Competitive price
High durability
Application : Semiconductor / CVD / Etcher / etc
SIze : 4'' ~ 12''
4. AIN HEATER
Characteristics
Using AIN with high thermal conductivity
Excellent temperature uniformity
It has characteristic inspection facilities through IR cameras and TC wafers
Application : Semiconductor / CVD / etc
Size : 4'' ~ 12''
Characteristics of ESC
Low price
Quick dechucking
Buried helium tunnel
Alumina / Coulombic type
Low leakage current → Less damage to Device
ESC's field and application process
A key component that fixes the substrate to the lower electrode using the force of static electricity. When DC power is applied to the electrostatic chuck, opposite potentials are charged to the object, and forces attracting each other by the charged potential are generated
ESC is a component that fixes Wafer in semiconductor manufacturing equipment using electrostatic force, and is generally divided into Monopolar(Unipolar) and Bipolar types according to the number of electrodes, and is also divided into columb and Jonsen-Rahb types according to the size of dielectric layer resistivity